SMT车间参观讲解双语话术

SMT车间参观讲解双语话术

一、前台引路

中文：各位专家，欢迎莅临XXXX参观指导。这里是十万级恒温恒湿无尘净化车间，进入车间需统一穿戴防静电服、防静电帽，感谢各位的配合。

English：Dear experts, welcome to XXXX. This is a Class 100,000 temperature and humidity controlled dust-free purification workshop. Please wear anti-static gowns and caps before entry. Thank you for your cooperation.

二、车间整体简介

中文：各位现在所处的是公司十万级无尘净化生产车间，车间全程恒温恒湿管控，常年温度稳定在23℃（±3℃），环境湿度维持在45%RH（±15%RH）。标准化、洁净的生产环境，是高品质电子产品量产的核心基础。我们整条SMT生产线均配置原装进口生产及检测设备，具备高精度、高速度、高稳定性的核心优势，单条生产线设备总投资达1200万元。

English：We are now in our Class 100,000 dust-free purification workshop with constant temperature and humidity control. The ambient temperature is steadily maintained at 23℃ (±3℃) and relative humidity at 45%RH (±15%RH). The standardized and ultra-clean production environment lays a solid foundation for the mass production of high-quality electronic products. Our entire SMT production line is equipped with fully imported production and testing equipment, delivering outstanding accuracy, speed and stability. The total equipment investment of this single production line reaches 12 million RMB.

三、锡膏印刷机（DEK）

中文：首先，我们将拆封完成的空白PCB板放入自动上板机，设备自动完成送板、传板，将PCB输送至首道核心工序——锡膏印刷。这是德国原装进口DEK高速全自动锡膏印刷机，依托高清视觉对位系统实现全自动化印刷作业，印刷精度可达20微米，仅为人类发丝直径的四分之一，从源头保障PCB印刷的均匀度与精准度。

English：First, unpacked bare PCBs are loaded into the automatic board loader, which automatically feeds and transfers PCBs to the first core process: solder paste printing. This is a high-speed fully automatic DEK solder paste printer imported from Germany. Adopting high-definition visual alignment technology, it supports fully automated printing with an accuracy of 20 micrometers, equivalent to one quarter of the diameter of a human hair, ensuring precise and uniform PCB printing from the initial process.

四、锡膏自动检测仪 SPI（KOHYOUNG）

中文：这是韩国KOHYOUNG品牌锡膏自动检测仪SPI，是锡膏印刷品质管控的核心设备。完成印刷的PCB板会自动送入设备检测，系统全方位采集并检测锡膏的高度、面积、体积及成型状态，精准识别少锡、多锡、偏位、空洞等各类印刷不良。一旦检出不良品，设备立即触发声光报警，提示操作人员及时干预处理，全面锁定印刷工序品质。

English：This is an automatic solder paste detector (SPI) manufactured by Korea’s KOHYOUNG, serving as the core quality control equipment for solder paste printing. All printed PCBs are automatically fed into the device for inspection. The system comprehensively detects and analyzes the height, area, volume and forming status of solder paste, accurately identifying various printing defects such as insufficient solder, excess solder, offset and voids. It triggers an immediate audio-visual alarm once defective products are detected, prompting operators for timely intervention and thoroughly securing printing quality.

五、高速贴片机（西门子）

中文：通过锡膏检测的PCB板将进入贴片工序。我们采用德国西门子高速高精度贴片机，设备产能可达每小时10万点，能高效完成大批量元器件贴装。同时贴装精度高达50微米，可实现01005超微型精密元器件的稳定贴装，属于行业顶尖的贴装设备。此外，我们配套启用物料强制扫描核验系统，换料、上料全程扫码溯源，从流程上杜绝错料、混料问题，保障生产一致性。

English：PCBs that pass solder paste inspection will proceed to the component placement process. We adopt high-speed and high-precision placement machines from Germany’s Siemens, with a production capacity of 100,000 placements per hour for high-volume production. Featuring a placement accuracy of up to 50 micrometers, it enables stable mounting of ultra-fine 01005 components, ranking among the top-tier placement equipment in the industry. In addition, we deploy a mandatory material scanning and verification system. Full-scan traceability is implemented during material replacement and loading, effectively eliminating material mismatch and mixing risks and ensuring consistent production quality.

六、回流焊炉（ERSA）

中文：元器件贴装完成后，PCB板进入回流焊工序。这是德国ERSA原装回流焊炉，凭借精准的温控算法与超高设备稳定性，是电子焊接行业的标杆设备。贴装后的PCB板在炉内按预设曲线精准升温，当温度达到217℃时，锡膏充分熔融，再经过梯度降温完成固化。为杜绝焊点氧化、提升焊接可靠性，全程采用氮气保护焊接环境，炉内氧含量严格控制在700ppm以内。

English：After component placement, PCBs enter the reflow soldering process. This is an original ERSA reflow oven from Germany. As a benchmark device in the electronic soldering industry, it features precise temperature control algorithms and ultra-high operational stability. Populated PCBs are heated strictly in accordance with preset temperature profiles. The solder paste fully melts at 217℃ and solidifies after gradient cooling. To prevent solder joint oxidation and improve soldering reliability, the entire soldering process is conducted under a nitrogen-protected atmosphere, with the internal oxygen content strictly controlled below 700ppm.

七、自动光学检测仪 AOI（欧姆龙）

中文：回流焊接完成后，我们通过日本欧姆龙全自动AOI光学检测仪完成成品外观与焊点质检。设备搭载高清成像系统，精准拍摄PCBA板面图像，与标准工艺参数阈值智能比对，可高效识别少锡、虚焊、短路、元器件错装、极性反接、丝印异常等各类焊接与贴片缺陷，全方位把控PCBA成品良率。

English：After reflow soldering, full quality inspection of PCBA appearance and solder joints is conducted via Japan’s Omron fully automatic AOI (Automatic Optical Inspection) equipment. Equipped with a high-definition imaging system, the device captures high-precision PCBA images and intelligently compares them with standard process thresholds. It efficiently identifies various soldering and mounting defects including insufficient solder, cold joints, short circuits, wrong components, reversed polarity and silkscreen abnormalities, fully guaranteeing the yield rate of finished PCBA products.

八、选择性波峰焊（ERSA）

中文：这是德国ERSA选择性波峰焊设备，主要用于精密通孔元器件的定点焊接，设备整体分为助焊剂喷涂、预热、焊接三大功能区域。设备可针对PCB通孔点位，精准实现点状、线状助焊剂喷涂；预热阶段PCB板保持静止，通过精准控时红外加热，实现均匀、可控的预热效果，避免板材受热变形。预热完成后，PCBA进入焊接区，设备将锡银铜无铅焊料高温熔融，通过专用喷嘴从板底精准喷射，完成通孔定点焊接。设备搭载专属焊点优化功能，焊接收尾时自动收锡整形，有效改善焊点外观、提升焊接品质。前方显示屏实时监控喷嘴运行状态，可直观查看全程焊接过程。

English：This is an ERSA selective wave soldering machine from Germany, specially designed for fixed-point soldering of precision through-hole components. The equipment consists of three functional zones: flux spraying, preheating and soldering. It enables targeted dot and line flux spraying on PCB through holes. During preheating, PCBs remain stationary and are heated by timed infrared radiation, achieving uniform and controllable preheating and avoiding board deformation caused by uneven temperature. After preheating, the PCBA enters the soldering zone. The tin-silver-copper lead-free solder is melted at high temperature and precisely jetted through dedicated nozzles from the bottom of the board to complete fixed-point through-hole soldering. Equipped with a exclusive solder joint optimization function, the machine automatically retracts and shapes solder at the end of soldering to refine joint appearance and enhance soldering quality. The front display screen monitors nozzle operation in real time, enabling intuitive observation of the entire soldering process.

九、全氮气波峰焊（ERSA）

中文：刚才我们介绍了贴片元器件的自动化焊接工艺，现在为大家介绍通孔插件元器件的焊接流程。通孔工艺采用人工插件、自动化波峰焊焊接模式，由员工完成元器件引脚插装后，送入设备完成批量焊接。这台是德国ERSA全氮气波峰焊设备，同样分为助焊剂喷涂、预热、焊接三大模块。设备对PCB通孔均匀喷涂助焊剂，PCB板随传送带匀速移动完成红外预热，保证板面温度均匀稳定。预热后的板卡进入焊接区，无铅焊料熔融后形成稳定锡波，从板底完成通孔整体焊接。全程氮气保护环境可有效维持焊料流动性，减少氧化与虚焊问题，操作人员可通过观察窗实时查看板卡过锡焊接状态。至此，通孔焊接工序介绍完毕。

English：We have just introduced the automatic soldering process for SMD components. Now let’s move on to the soldering process for through-hole components. The through-hole process adopts manual component insertion and automatic wave soldering. After operators finish inserting component pins, PCBs are sent to the equipment for batch soldering. This is a full-nitrogen wave soldering machine manufactured by Germany’s ERSA, which also consists of three core modules: flux spraying, preheating and soldering. The equipment sprays flux evenly on PCB through holes, and PCBs move uniformly with the conveyor for infrared preheating to ensure consistent board temperature. Preheated boards enter the soldering zone, where lead-free solder melts into a stable solder wave to complete integral through-hole soldering from the board bottom. The full-process nitrogen protection environment maintains excellent solder fluidity and reduces oxidation and cold joint risks. Operators can observe the entire soldering process through the viewing window. This concludes the introduction to the through-hole soldering process.

十、X-Ray无损检测设备

中文：这台是X-Ray无损检测设备，依托X射线穿透成像原理，实现PCB及元器件内部结构的非破坏性检测，可精准检测元器件封装缺陷、板材裂纹、通孔填锡饱满度等隐患，严格对标IPC-610行业品质标准。通过X射线成像，我们可直观观测内部焊点成型状态与焊接质量，核心检测抽样标准规范清晰：1、试产阶段：前20片产品100%全检，量产稳定后每小时抽样2片；试产总量不足20片时，执行全数检测。2、换线、换班节点：首5片产品全检，后续维持每小时2片的抽样检测标准，全方位把控隐蔽工序品质。

English：This is an X-Ray non-destructive testing device. Based on X-ray penetration imaging technology, it realizes non-destructive detection of the internal structure of PCBs and components. It accurately identifies hidden defects such as component package flaws, board cracks and insufficient through-hole solder filling, fully complying with IPC-610 industry quality standards. X-ray imaging enables intuitive observation of internal solder joint forming status and welding quality. Our standardized inspection sampling rules are strictly implemented as follows: 1. Trial production stage: 100% full inspection for the first 20 units; 2 units sampled per hour after stable mass production. 100% full inspection is mandatory if the total trial production quantity is less than 20 units. 2. Line change and shift change: full inspection for the first 5 units, followed by 2-unit hourly sampling to comprehensively control the quality of hidden processes.

十一、智能仓储系统

中文：最后为大家介绍我们的智能仓储系统，这是行业领先的自动化物料存储设备，相较于传统货架仓储模式，在存储效率、物料管控、品质保障上具备多重核心优势：第一，占地小、库容大、空间利用率极高，单台设备可存储超10000盘电子物料，存储容量远超传统仓储货架，大幅节省车间仓储空间。第二，全域条码智能化管理，实现物料出入库自动化作业。入库时仅需扫描物料二维码，系统自动智能分配储位、完成入库归档；出库模式灵活，支持单盘物料精准出库，也可依托生产工单、物料清单批量出料，大幅提升仓储周转效率。第三，严格落实先进先出管控，系统依据物料原厂生产日期自动排序出料，彻底规避人工管理导致的物料积压、过期风险。第四，支持氮气充入除湿管控，可精准调控仓储内部温湿度，为精密电子元器件提供恒温恒湿、低氧防潮的存储环境，从仓储环节保障物料品质稳定。

English：Finally, let’s look at our intelligent warehousing system. As an industry-leading automated material storage device, it has multiple core advantages in storage efficiency, material management and quality assurance compared with traditional shelf warehousing. First, it features a compact footprint and ultra-large capacity with high space utilization. A single device can store more than 10,000 reels of electronic materials, with a storage capacity far exceeding traditional shelves, greatly saving workshop storage space. Second, full-domain barcode intelligent management realizes automated material inbound and outbound operations. For inbound storage, the system automatically allocates storage locations and completes archiving by simply scanning material QR codes. For outbound delivery, it supports accurate single-reel picking and batch delivery via work orders and material lists, significantly improving inventory turnover efficiency. Third, it strictly implements FIFO (First In, First Out) management. The system automatically sorts and discharges materials according to the original production date, completely avoiding material backlog and expiration risks caused by manual management errors. Fourth, it supports nitrogen purging and dehumidification, with precise internal temperature and humidity control. It provides a constant-temperature, constant-humidity and low-moisture storage environment for precision electronic components, ensuring stable material quality from the storage link.